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Whitepapers from Beehive Electronics

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Effective EMC Troubleshooting with Handheld Probes

Beehive Electronics

This application note from Beehive Electronics, co-authored with Pacifica International, addresses the costly and time-consuming cycle of returning a product to an external EMC test facility after every design modification attempt. The document argues that by establishing a reliable correlation between benchtop handheld probe measurements and screen room test results, engineers can validate design fixes in their own lab and limit screen room visits to a final confirmation pass. The Beehive 101A probe set is highlighted as suitable for this role due to its calibrated, repeatable sensitivity across a wide frequency range, coverage of both electric and magnetic field types, and compact form factor with push-on connectors. A detailed real-world case study illustrates the approach: a product failed CISPR 11 radiated emissions testing at 100 MHz by 22 dB, a margin considered very difficult to recover without significant redesign. Back in the lab, a Beehive 100A probe was used to trace the emission to the LAN cable, and further internal probing identified the source as the fifth harmonic of a 20 MHz microprocessor clock coupling into LAN circuitry. With the probe fixed to the LAN cable and connected to a spectrum analyzer, each design change was evaluated sequentially. Two fixes — adding ferrites to the LAN transmit and receive lines and replacing the LAN transformer with a model incorporating a built-in EMI suppressor — were predicted by bench measurements to achieve the required 22 dB reduction. On the single return visit to the screen room, the product passed, demonstrating that good lab-to-test-site correlation can collapse a multi-iteration remediation process into a single successful retest.

Near Field Probes

Non-contact Probing of RF Circuits with the Beehive 100 Series Probes

Beehive Electronics

This application note from Beehive Electronics explains the advantages of passive non-contact probing for testing RF circuits on highly integrated printed circuit boards, where traditional coaxial test connections no longer exist. The document contrasts non-contact probes with conventional contact probes, noting that contact probes suffer from capacitive loading, ground inductance from lead connections, and the physical difficulty of simultaneously maintaining a signal and ground connection without accidentally shorting a circuit. Non-contact probes eliminate all three problems because they couple to the electromagnetic field around a conductor without touching it. The document distinguishes E-field probes, which measure voltage-proportional electric fields and offer fine spatial resolution down to individual IC pins, from H-field probes, which measure current-proportional magnetic fields and are available in different loop sizes to trade off sensitivity against frequency range and spatial resolution. Measured coupling factors between each probe model and 50-ohm microstrip lines on three standard FR4 substrate thicknesses are provided across frequency, enabling absolute power estimates from relative probe readings. A fault-finding demonstration on a test board containing amplifiers, attenuators, and a splitter shows that a faulty amplifier with a disconnected power supply could be identified by walking the probe along the signal chain in under a minute. The document also demonstrates that probe sensitivity is sufficient for high-dynamic-range measurements such as phase noise, showing a 39 dB margin above the spectrum analyzer noise floor in a worked example at 3 GHz.

Near Field Probes